I-Crystal Cylinder-Plating yegolide efakwe ngegolide kanye Nokufakwa Kwethusi

Ama-laser we-laser crystal we-slab amancane angathola amandla aphezulu kanye nekhwalithi enhle ye-boam ngokusebenzisa le ndlela yokushisela, kodwa kumakristalu e-laser angamasayizi amakhulu (≥100mm2), le ndlela yokushisela yendabuko ijwayele ukuba nama-voids amakhulu (≥ 1mm2), indawo enkulu yokunamathisela okubonakalayo, kanye nokusatshalaliswa kwe-solder kongqimba oluhlanganisiwe alulingani. Lokhu ikakhulukazi kungenxa yokuthi ikristalu ye-laser slab iyashiswa endaweni ye-vacuum, izinga lokushisa lihamba kancane, futhi inqubo yokufudumeza nokupholisa ihamba kancane, okuholela ekushiseni okungalingani kwekristalu ye-laser ye-slab, futhi kulula ukubangela ingxenye ye-solder ukuthi incibilike kuqala, ingxenye ngemva kokuncibilika, kanye nengxenye ye-solder ukuthi incibilike kuqala. Ukuqiniswa, enye ingxenye yesenzakalo sangemuva kokuqiniswa. Ngakho-ke, ngesikhathi sokushisa kwe-slab laser crystal, ingxenye ye-solder encibilika kuqala iqeda ukushisela nokugeleza, ezungeze ingxenye engancibilikisiwe, okulula ukudala izinkinga ezifana ne-voids, i-solder ebonakalayo kanye nokusabalalisa okungalingani kwe-solder. Enqubweni yokupholisa phansi, unqenqema lwekristalu ye-laser slab kuvame ukupholiswa kuqala. Ngakho-ke, i-solder emaphethelweni iqinisa kuqala, bese ipholisa ingxenye ephakathi eqinile. Isigaba se-liquid siphenduka isigaba esiqinile futhi sivame ukuncipha ngevolumu, ethambekele ekubeni ne-voids kanye ne-solder ebonakalayo.
Inkampani yethu ingahlinzeka ngezinsizakalo zokucwebezelisa igolide ne-copper plating. Ukucwecwa kwegolide ngezinti zekristalu, ukucwecwa kwegolide ngezinti. Umsebenzi ukuthi ikristalu ingashiselwa ngokuqinile kusinki wokushisa, futhi ingakhipha ukushisa ngaleyo ndlela ithuthukise ikhwalithi ye-beam.