I-Crystal Cylinder-Plating yegolide efakwe ngegolide kanye Nokufakwa Kwethusi

Ama-laser we-laser crystal we-slab amancane angathola amandla aphezulu kanye nekhwalithi enhle ye-boam ngokusebenzisa le ndlela yokushisela, kodwa kumakristalu we-laser angamasayizi amakhulu (≥100mm2), le ndlela yokushisela yendabuko ivame ukuba ne-void enkulu (≥ 1mm2), enkulu. indawo ye-solder ye-virtual, futhi ukusatshalaliswa kwe-solder kwesendlalelo se-solder akulingani. Lokhu kubangelwa ikakhulukazi ukuthi ikristalu ye-laser slab iyashiswa endaweni ye-vacuum, izinga lokushisa lihamba kancane, futhi inqubo yokufudumeza nokupholisa ihamba kancane, okuholela ekushiseni okungalingani kwekristalu ye-slab laser, futhi kulula ukuyifaka. yenza ukuthi ingxenye ye-solder incibilike kuqala, ingxenye ngemva kokuncibilika, futhi ingxenye ye-solder incibilike kuqala. Ukuqiniswa, enye ingxenye yesenzakalo sangemuva kokuqiniswa. Ngakho-ke, ngesikhathi sokushisa kwe-slab laser crystal, ingxenye ye-solder encibilika kuqala iqeda ukushisela nokugeleza, ezungeze ingxenye engancibilikisiwe, okulula ukudala izinkinga ezifana ne-voids, i-solder ebonakalayo kanye nokusabalalisa okungalingani kwe-solder. Enqubweni yokupholisa phansi, unqenqema lwekristalu ye-laser slab kuvame ukupholiswa kuqala. Ngakho-ke, i-solder emaphethelweni iqinisa kuqala, bese ipholisa ingxenye ephakathi eqinile. Isigaba se-liquid siphenduka isigaba esiqinile futhi sivame ukuncipha ngevolumu, ethambekele ekubeni ne-voids kanye ne-solder ebonakalayo.
Inkampani yethu ingahlinzeka ngezinsizakalo zokucwebezelisa igolide ne-copper plating. Ukucwecwa kwegolide ngezinti zekristalu, ukucwecwa kwegolide ngezinti. Umsebenzi ukuthi ikristalu ingashiselwa ngokuqinile kusinki wokushisa, futhi ingakhipha ukushisa ngaleyo ndlela ithuthukise ikhwalithi ye-beam.